Was attending my tutorial today when my lecturer raise a question on the phenomenon of tin degradation in electronics.
Basically all electronic components are soldered. Solder contains tin and lead. Both of these are mixed together to give it a low melting point suitable for soldering.
Lead free solder contains copper or silver based on RoHS compliance.
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Pure tin under cold temperature < -20 degrees C, will undergo allotropic transformation from beta form to alpha form.
You can check out the video on 'tin pest'
It is relatively safe in modern solders as other elements are added to tin to greatly inhibit the transformation at low temperature, although it still takes place.
If you are planning to go overseas to a very cold country, try to keep electronic devices from the extreme cold for too long.
Basically all electronic components are soldered. Solder contains tin and lead. Both of these are mixed together to give it a low melting point suitable for soldering.
Lead free solder contains copper or silver based on RoHS compliance.
------------------------------------
Pure tin under cold temperature < -20 degrees C, will undergo allotropic transformation from beta form to alpha form.
You can check out the video on 'tin pest'
It is relatively safe in modern solders as other elements are added to tin to greatly inhibit the transformation at low temperature, although it still takes place.
If you are planning to go overseas to a very cold country, try to keep electronic devices from the extreme cold for too long.
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